RK

Ryuichi Kyomasu

SH Shinkawa: 2 patents #2 of 13Top 20%
📍 Kodaira, JP: #15 of 128 inventorsTop 15%
Overall (2005): #36,507 of 245,428Top 15%
2
Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6871772 Wire bonding apparatus Yutaka Kondo 2005-03-29
6863206 Bonding apparatus Yasushi Suzuki 2005-03-08