MS

Mitsuaki Sakakura

SH Shinkawa: 1 patents #4 of 13Top 35%
Overall (2005): #135,060 of 245,428Top 60%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6874673 Initial ball forming method for wire bonding wire and wire bonding apparatus Shinichi Nishiura, Fumio Miyano 2005-04-05