Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D510728 | Semiconductor device package | Phillip Celaya, Michael J. Seddon | 2005-10-18 |
| D504874 | Semiconductor device package | Phillip Celaya, Michael J. Seddon | 2005-05-10 |
| 6852574 | Method of forming a leadframe for a semiconductor package | Guan Keng Quah | 2005-02-08 |