Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6924226 | Methods for making multiple seed layers for metallic interconnects | — | 2005-08-02 |
| 6903016 | Combined conformal/non-conformal seed layers for metallic interconnects | — | 2005-06-07 |
| 6869515 | Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings | — | 2005-03-22 |