Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953745 | Void-free metal interconnection structure and method of forming the same | Jeong Hoon Ahn, Hyo-Jong Lee, Kyoung-Woo Lee, Soo-geun Lee, Bong Seok Suh | 2005-10-11 |
| 6940114 | Integrated circuit devices including a MIM capacitor | Byung-jun Oh, Mu-kyeng Jung | 2005-09-06 |
| 6911397 | Method of forming dual damascene interconnection using low-k dielectric | Jin-Won Jun, Young-Wug Kim, Tae Soo Park | 2005-06-28 |