Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949837 | Bonding pad arrangement method for semiconductor devices | Ho-Cheol Lee, Jae Hoon Kim | 2005-09-27 |
JR
Jung-Su Ryu
Overall (2005): #165,780 of 245,428Top 70%
1
Patents 2005