Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6884650 | Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same | Eun Sung Lee, Byeong-cheon Koh, Kukjin Chun | 2005-04-26 |
CM
Chang-youl Moon
Overall (2005): #223,410 of 245,428Top 95%
1
Patents 2005