Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6963141 | Semiconductor package for efficient heat spreading | Jung-Yu Lee | 2005-11-08 |
| 6921967 | Reinforced die pad support structure | Jun-Chun Shih, Kuang-Yang Chen, Kuo-Chang Tan, Hsi-Hsun Ho, June-Wen Liao +1 more | 2005-07-26 |