Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6884661 | Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices | Thomas Scott Morris, Jon D. Jorgenson | 2005-04-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6884661 | Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices | Thomas Scott Morris, Jon D. Jorgenson | 2005-04-26 |