Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6881369 | Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same | Yuh-Wen Lee, Liang-Yu Yao, Jeng-En Juang, Ching-Yi Wu | 2005-04-19 |