Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867069 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin | Yoshimi Egawa, Kazumi Shinchi | 2005-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867069 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin | Yoshimi Egawa, Kazumi Shinchi | 2005-03-15 |