Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6894385 | Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology | Ray T. Chen | 2005-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6894385 | Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology | Ray T. Chen | 2005-05-17 |