Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6978714 | Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layers | Michitoshi Nakata | 2005-12-27 |
| 6960729 | Upright-pin-joined resin substrate, method of producing the substrate, pins, and method of producing the pins | Noritaka Miyamoto | 2005-11-01 |