Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919272 | Method for patterning densely packed metal segments in a semiconductor die and related structure | Tinghao Wang, Dieter Dornisch, Hadi Abdul-Ridha, David J. Howard | 2005-07-19 |