Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6929973 | Method of packaging electronic components with high reliability | Hiroshi Sakai, Makoto Igarashi, Akihiro Tanaka | 2005-08-16 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy | Shinji Watanabe, Hiroshi Sakai, Makoto Igarashi, Akihiro Tanaka | 2005-07-12 |
| 6857361 | Method and apparatus for printing solder paste of different thickness on lands on printed circuit board | Hiroshi Sakai, Makoto Igarashi, Akihiro Tanaka | 2005-02-22 |