Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917525 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs | Sammy Mok, Fu Chiung Chong, Syamal Kumar Lahiri, Joseph Haemer | 2005-07-12 |