Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6871388 | Method of forming an electronic component located on a surface of a package member with a space therebetween | Kenji Kubota, Tsuyoshi Saito, Michinobu Maesaka, Mamoru Ogawa, Jiro Inoue +1 more | 2005-03-29 |