Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905757 | DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE | Toshifumi Matsushima, Hideaki Miwa, Akira Ichiryu, Kazuhiro Yamazaki, Tetsuro Sato | 2005-06-14 |
| 6884944 | Multi-layer printed wiring boards having blind vias | — | 2005-04-26 |