Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962867 | Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof | Timothy L. Jackson | 2005-11-08 |
| 6936489 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2005-08-30 |