Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975035 | Method and apparatus for dielectric filling of flip chip on interposer assembly | — | 2005-12-13 |
| 6940179 | Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same | — | 2005-09-06 |