Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964881 | Multi-chip wafer level system packages and methods of forming same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo +2 more | 2005-11-15 |
| 6958537 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2005-10-25 |