Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921860 | Microelectronic component assemblies having exposed contacts | Darin L. Peterson, Choon Kuan Lee, James A. Faull | 2005-07-26 |
| 6869811 | Methods for transfer molding encapsulation of a semiconductor die with attached heat sink | — | 2005-03-22 |