JD

James M. Derderian

Micron: 3 patents #201 of 861Top 25%
📍 Boise, ID: #106 of 564 inventorsTop 20%
🗺 Idaho: #145 of 1,002 inventorsTop 15%
Overall (2005): #22,813 of 245,428Top 10%
3
Patents 2005

Issued Patents 2005

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6940181 Thinned, strengthened semiconductor substrates and packages including same Nathan R. Draney 2005-09-06
6869828 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods 2005-03-22
6870269 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods 2005-03-22