Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872902 | MEMS device with integral packaging | Ji-Hai Xu | 2005-03-29 |
| 6853067 | Microelectromechanical systems using thermocompression bonding | Joseph T. Kung | 2005-02-08 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872902 | MEMS device with integral packaging | Ji-Hai Xu | 2005-03-29 |
| 6853067 | Microelectromechanical systems using thermocompression bonding | Joseph T. Kung | 2005-02-08 |