Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917105 | Integrating chip scale packaging metallization into integrated circuit die structures | — | 2005-07-12 |
| 6900538 | Integrating chip scale packaging metallization into integrated circuit die structures | Robert Rumsey | 2005-05-31 |