Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951808 | Metal planarization system | Samuel V. Dunton, Ronald J. Nagahara | 2005-10-04 |
| 6838379 | PROCESS FOR REDUCING IMPURITY LEVELS, STRESS, AND RESISTIVITY, AND INCREASING GRAIN SIZE OF COPPER FILLER IN TRENCHES AND VIAS OF INTEGRATED CIRCUIT STRUCTURES TO ENHANCE ELECTRICAL PERFORMANCE OF COPPER FILLER | Byung Sung Kwak, William K. Barth | 2005-01-04 |