Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897555 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die | Wee Liew, Chengyu Guo | 2005-05-24 |