Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6963129 | Multi-chip package having a contiguous heat spreader assembly | Thomas R. Evans, Stan Mihelcic, Leah M. Miller, Kumar Nagarajan | 2005-11-08 |
| 6867488 | Thick metal top layer | — | 2005-03-15 |