Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977024 | Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies | Osamu Yamazaki | 2005-12-20 |
| 6911720 | Semiconductor device adhesive sheet with conductor bodies buried therein | Osamu Yamazaki | 2005-06-28 |
| 6900550 | Semiconductor device including adhesive agent layer with embedded conductor bodies | Osamu Yamazaki | 2005-05-31 |
| 6855418 | Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same | Osamu Yamazaki, Hideo Senoo | 2005-02-15 |