Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867486 | Stack chip module with electrical connection and adhesion of chips through a bump for improved heat release capacity | — | 2005-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867486 | Stack chip module with electrical connection and adhesion of chips through a bump for improved heat release capacity | — | 2005-03-15 |