Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893738 | Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil | Chang Hee Choi | 2005-05-17 |
| 6878261 | Surface treatment method of copper foil with silane coupling agent | Chang Hee Choi, Byoung-Un Kang | 2005-04-12 |