Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6930399 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same | Myung Jin Yim | 2005-08-16 |
| 6878435 | High adhesion triple layered anisotropic conductive adhesive film | Myung Jin Yim | 2005-04-12 |