Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6940176 | Solder pads for improving reliability of a package | — | 2005-09-06 |
| 6881654 | Solder bump structure and laser repair process for memory device | Hung-Min Liu | 2005-04-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6940176 | Solder pads for improving reliability of a package | — | 2005-09-06 |
| 6881654 | Solder bump structure and laser repair process for memory device | Hung-Min Liu | 2005-04-19 |