Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951125 | System and method for aligning an integrated circuit die on an integrated circuit substrate | Harry Michael Siegel | 2005-10-04 |
| 6919230 | Method of eliminating uncontrolled voids in sheet adhesive layer | — | 2005-07-19 |
| 6908787 | System and method for increasing the strength of a bond made by a small diameter wire in ball bonding | — | 2005-06-21 |
| 6900508 | Embedded flat film molding | Harry Michael Siegel | 2005-05-31 |