Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6911834 | Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing | Scott W. Mitchell, Reynaldo Rincon, Gerard Laugier | 2005-06-28 |
| 6906539 | High density, area array probe card apparatus | Lester Wilson, Reynaldo Rincon, Richard W. Arnold | 2005-06-14 |