Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967412 | Wafer level underfill and interconnect process | — | 2005-11-22 |
| 6930397 | Surface mounted package with die bottom spaced from support board | Andrew N. Sawle | 2005-08-16 |
| 6890845 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2005-05-10 |
| D503691 | Conductive clip for a semiconductor package | Hazel Schofield | 2005-04-05 |
| D502151 | Semiconductor package | — | 2005-02-22 |
| 6841865 | Semiconductor device having clips for connecting to external elements | — | 2005-01-11 |