Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949822 | Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance | Bharat Shivkumar | 2005-09-27 |
| 6896976 | Tin antimony solder for MOSFET with TiNiAg back metal | — | 2005-05-24 |