Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6908027 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process | Peter G. Tolchinsky, Mohamad A. Shaheen, Irwin Yablok | 2005-06-21 |