Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955947 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Biju Chandran | 2005-10-18 |
| 6861285 | Flip chip underfill process | — | 2005-03-01 |