Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974765 | Encapsulation of pin solder for maintaining accuracy in pin position | — | 2005-12-13 |
| 6867060 | Wafer-level packaging of electronic devices before singulation | Steve Greathouse | 2005-03-15 |
| 6852926 | Packaging microelectromechanical structures | Qing Ma, Valluri Rao, John Heck, Daniel ManHung Wong | 2005-02-08 |