Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921706 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Gregory M. Chrysler, Abhay Watwe, Sairam Agraharam, Kramadhati V. Ravi | 2005-07-26 |