Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6914317 | Thin microelectronic substrates and methods of manufacture | Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley | 2005-07-05 |
| 6864565 | Post-passivation thick metal pre-routing for flip chip packaging | Vincent Hool | 2005-03-08 |