Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903278 | Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate | — | 2005-06-07 |
| 6840777 | Solderless electronics packaging | Paul H. Wermer | 2005-01-11 |