Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6845557 | Method for producing an electronic package possessing controlled impedance characteristics | Thomas R. Miller, Robert J. Testa, Kevin Unger, Michael Wozniak | 2005-01-25 |
| 6841026 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, John Frank Surowka | 2005-01-11 |