WB

William E. Bernier

IBM: 1 patents #1,781 of 5,214Top 35%
📍 Endwell, NY: #7 of 21 inventorsTop 35%
🗺 New York: #2,313 of 8,003 inventorsTop 30%
Overall (2005): #77,519 of 245,428Top 35%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6921015 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder Donald W. Henderson, James Spalik, Isabelle Paquin 2005-07-26