Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6900142 | Inhibition of tin oxide formation in lead free interconnect formation | Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, David E. Eichstadt, Henry A. Nye, III +1 more | 2005-05-31 |
| 6893799 | Dual-solder flip-chip solder bump | David Danovitch | 2005-05-17 |