PH

Paul M. Harvey

IBM: 2 patents #845 of 5,214Top 20%
🗺 Texas: #960 of 8,064 inventorsTop 15%
Overall (2005): #40,077 of 245,428Top 20%
2
Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6876088 Flex-based IC package construction employing a balanced lamination 2005-04-05
6867121 Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction 2005-03-15