Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6956286 | Integrated circuit package with overlapping bond fingers | Edward M. Wolf | 2005-10-18 |
| 6946746 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud | 2005-09-20 |
| 6908855 | Plating tail design for IC packages | Edward M. Wolf | 2005-06-21 |
| 6882038 | Plating tail design for IC packages | Edward M. Wolf | 2005-04-19 |