Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6952352 | Integrated circuit chip package with formable intermediate 3D wiring structure | Philip G. Emma, Robert K. Montoye | 2005-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6952352 | Integrated circuit chip package with formable intermediate 3D wiring structure | Philip G. Emma, Robert K. Montoye | 2005-10-04 |