JR

James Rau

HO Honeywell: 1 patents #221 of 867Top 30%
🗺 New York: #2,313 of 8,003 inventorsTop 30%
Overall (2005): #179,998 of 245,428Top 75%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6958533 High density 3-D integrated circuit package Larry R. Adkins, A. James Hughes, Gerard J. Sullivan 2005-10-25